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| (R) SP3220E/EB/EU +3.0V to +5.5V RS-232 Driver/Receiver Pair Meets All EIA-232 and ITU V.28 Specifications from a wide +3.0V to +5.5V power supply EN Interoperable with RS232 and V.28 at 2.7V C1+ Supports High Serial DataRates: 120 kbps SP3220E V+ 250 kbps SP3220EB C1 1 Mbps SP3220EU 1A Low Power Shutdown Mode C2+ Footprint Compatible with MAX3221E, ISL3221 C2 4 x 0.1F External Charge Pump Capacitors Tri-State/Receiver Enable V Improved ESD Specifications: +15kV Human Body Model R1IN +15kV IEC1000-4-2 Air Discharge +8kV IEC1000-4-2 Contact Discharge 1 2 3 4 5 6 7 8 SP3220 E/EB/EU 16 SHDN 15 VCC 14 GND 13 T1OUT 12 No Connect 11 T1IN 10 No Connect 9 R1OUT Available in Lead Free Packaging DESCRIPTION The SP3220E devices are RS-232 driver/receiver solutions intended for portable or hand-held applications such as palmtop computers, instrumentation and consumer products. These devices incorporate a high-efficiency charge-pump power supply that allows the SP3220E devices to deliver true RS-232 performance from a single power supply ranging from +3.0V to +5.0V. This charge pump requires only 0.1F capacitors in 3.3V operation. The ESD tolerance of these devices is over 15kV for both Human Model and IEC1000-4-2 Air discharge test methods. All devices have a low-power shutdown mode where the driver outputs and charge pumps are disabled. During shutdown, the supply current falls to less than 1A. VCC C5 C1 + + 0.1F 2 C1+ 0.1F 4 C15 C2+ 0.1F 6 C211 T1IN 9 R1OUT 5k 1 EN GND 14 *can be returned to either VCC or GND SHDN 16 15 VCC V+ 3 *C3 7 C4 + 0.1F C2 + SP3220 E/EB/EU V- + 0.1F LOGIC INPUTS LOGIC OUTPUTS T1OUT R1IN 13 8 RS-232 OUTPUTS RS-232 INPUTS Date: 8/22/05 Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation (c) Copyright 2005 Sipex Corporation 1 ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. VCC.............................................................-0.3V to +6.0V V+ (NOTE 1)..............................................-0.3V to +7.0V V- (NOTE 1).............................................+0.3V to -7.0V V+ + |V-| (NOTE 1)...................................................+13V ICC (DC VCC or GND current)..........................+100mA Input Voltages TxIN, EN, SHUTDOWN ................ -0.3V to VCC +0.3V RxIN ................................................................... +25V Output Voltages TxOUT ............................................................. +13.2V RxOUT ......................................... -0.3V to (VCC+0.3V) Short-Circuit Duration TxOUT ...................................................... Continuous Storage Temperature ....................... -65C to +150C Power Dissipation Per Package 16-pin SSOP (derate 9.69mW/oCabove+70oC) ........ 775mW 16-pin TSSOP (derate 10.5mW/oC above +70oC) ..... 840mW 16-pin Wide SOIC (derate 11.2mW/oC above+70oC) 900mW NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. SPECIFICATIONS Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.0V with TAMB = TMIN to TMAX. Typical Values apply at VCC = +3.3V or +5.0V and TAMB = 25oC, C1-4=0.1F. PARAMETER DC CHARACTERISTICS Supply Current Shutdown Supply Current 0.3 1.0 1.0 10 mA A no load, TAMB = +25oC, VCC = 3.3V, TxIN = GND or VCC _____ SHDN = GND, TAMB = +25oC, VCC = +3.3V, TxIN = GND or VCC MIN. TYP. MAX. UNITS CONDITIONS LOGIC INPUTS AND RECEIVER OUTPUTS Input Logic Threshold LOW Input Logic Threshold HIGH Input Leakage Current Output Leakage Current Output Voltage LOW Output Voltage HIGH DRIVER OUTPUTS Output Voltage Swing Output Resistance Output Short-Circuit Current Output Leakage Current 5.0 300 3 5 6 0 25 5.4 V mA A 3k load to ground at all driver outputs, TAMB = +25oC VCC = V+ = V- = GND, TOUT = +2V VOUT = GND VOUT = +12V,VCC= GND to 5.5V,drivers disabled VCC-0.6 VCC-0.1 GND 2 .0 2 .4 0 .0 1 0.05 1. 0 1 0 0. 4 0. 8 V V V A A V V TxIN, EN, SHDN, Note 2 VCC = 3.3V, Note 2 VCC = 5.0V, Note 2 __ _____ TxIN, EN, SHDN, TAMB = +25oC VIN = GND to VCC Receivers Disabled VOUT = GND to VCC IOUT = 1.6mA IOUT = -1.0mA ___ _______ NOTE 2: Driver input hysteresis is typically 250mV. Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation Date: 8/22/05 2 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation SPECIFICATIONS (continued) Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.0V with TAMB = TMIN to TMAX. Typical Values apply at VCC = +3.3V or +5.0V and TAMB = 25oC, C1-4=0.1F. PARAMETER RECEIVER INPUTS Input Voltage Range Input Threshold LOW Input Threshold HIGH Input Hysteresis Input Resistance TIMING CHARACTERISTICS Data Rate SP3220E Data Rate SP3220EB Data Rate SP3220EU Receiver Propagation Delay Receiver Output Enable Time Receiver Output Disable Time Driver Skew Receiver Skew Transition-Region Slew Rate 90 120 250 1000 0.15 0.15 20 0 200 100 50 30 235 Kbps Kbps Kbps s s ns ns ns ns V/s V/s | tPHL - tPLH |, TAMB = 25oC | tPHL - tPLH | VCC = 3.3V, RL = 3K, TAMB = 25oC, measurements taken from -3.0V to +3.0V or +3.0V to -3.0V (SP3220E and EB) (SP3220EU) RL=3k, CL=1000pF, one driver switching RL=3k, CL=1000pF RL=3k, CL= 250pF tPHL, RxIN to RxOUT, CL = 150pF tPHL, RxIN to RxOUT, CL = 150pF 3 -25 0.6 0.8 1.2 1.5 1.5 1.8 0. 3 5 7 2.4 2.4 +25 V V V V k VCC=3.3V VCC=5.0V VCC=3.3V VCC=5.0V MIN. TYP. MAX. UNITS CONDITIONS Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation 3 TYPICAL PERFORMANCE CHARACTERISTICS Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 250kbps data rates, all drivers loaded with 3k , 0.1F charge pump capacitors, and TAMB = +25C. 30 Transmitter Output Voltage (V) 6 T1 at Full Data Rate T2 at 1/16 Full Data Rate T1+T2 Loaded with 3k/CLoad 25 Icc (mA) 125Kbps 4 2 0 -2 -4 -6 0 1000 T1 at 250Kbps TxOUT + 20 60Kbps 15 10 5 0 0 1000 2000 3000 4000 5000 20Kbps TxOUT - Load Capacitance (pF) 2000 3000 4000 5000 Load Capacitance (pF) Figure 1. ICC vs Load Capacitance for the SP3220EB. Figure 2. Transmitter Output Voltage vs Load Capacitance for the SP3220EB. 6 12 TxOUT + Transmitter Output Voltage (V) 2 0 -2 -4 -6 2.7 3 TxOUT - Supply Current (mA) 4 10 8 6 4 2 0 2.7 T1 Loaded with 3K // 1000pf @ 250Kbps 3.5 4 Supply Voltage (V) 4.5 5 3 3.5 4 4.5 5 Supply Voltage (V) Figure 3. Transmitter Output Voltage vs Supply Voltage for the SP3220EB. Figure 4. Supply Current vs Supply Voltage for the SP3220EB. 25 Slew rate (V/s) 20 15 10 5 0 0 500 1000 2000 3000 4000 5000 - Slew + Slew 40 1Mbps 30 2Mbps 500Kbps Icc (mA) 20 10 0 0 250 500 1000 2000 3000 4000 Load Capacitance (pF) Load Capacitance (pF) Figure 5. Slew Rate vs Load Capacitance for the SP3220EB. Figure 4. Supply Current vs Supply Voltage for the SP3220EU. Date: 8/22/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver 4 (c) Copyright 2005 Sipex Corporation TYPICAL PERFORMANCE CHARACTERISTICS: Continued Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 250kbps data rates, all drivers loaded with 3k , 0.1F charge pump capacitors, and TAMB = +25C. 6 4 Transmitter Output Voltage (V) 6 2Mbps 1.5Mbps 1Mbps 4 TxOUT + 2 0 -2 -4 -6 2Mbps 1.5Mbps 1Mbps Transmitter Output Voltage (V) 2 0 -2 -4 -6 2.5 2.7 3 TxOUT - 0 250 500 1000 1500 2000 3.5 4 4.5 5 Load Capacitance (pF) Supply Voltage (V) Figure 7. Transmitter Output Voltage vs Load Capacitance for the SP3220EU. Figure 8. Transmitter Output Voltage vs Supply Voltage for the SP3220EU. 16 Supply Current (mA) 14 12 10 8 6 4 2 0 T1 Loaded with 3K // 1000pf @1Mbps 2.7 3 3.5 4 4.5 5 Supply Voltage (V) Figure 9. Supply Current vs Supply Voltage for the SP3220EU. Date: 8/30/05 Date: 8/22/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver SP3220E/EB/EU High ESD RS-232 Driver/Receiver 5 5 (c) Copyright 2005 Sipex Corporation (c) Copyright 2005 Sipex Corporation NAME EN C1+ V+ C1C2+ C2VR1IN R1OUT N.C. T1IN T1OUT GND V CC SHDN FUNCTION Receiver Enable Control. Drive LOW for normal operation. Drive HIGH to TriState the receiver outputs (high-Z state). Positive terminal of the voltage doubler charge-pump capacitor. +5.5V generated by the charge pump. Negative terminal of the voltage doubler charge-pump capacitor. Positive terminal of the inverting charge-pump capacitor. Negative terminal of the inverting charge-pump capacitor. -5.5V generated by the charge pump. RS-232 receiver input. TTL/CMOS reciever output. No Connect. TTL/CMOS driver input. RS-232 driver output. Ground. +3.0V to +5.5V supply voltage Shutdown Control Input. Drive HIGH for normal device operation. Drive LOW to shutdown the drivers (high-Z output) and the on-board charge pump power supply. PIN NUMBER 1 2 3 4 5 6 7 8 9 10, 12 11 13 14 15 16 Table 1. Device Pin Description Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation Date: 8/22/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation EN 1 16 SHDN 15 VCC 14 GND SP3220 E/EB/EU C1+ 2 V+ 3 C1C2VR1IN 4 6 7 8 C2+ 5 13 T1OUT 12 No Connect 11 T1IN 10 9 No Connect R1OUT Figure 10. Pinout Configurations for the SP3220E/EB/ EU Date: 8/22/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation 7 Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation VCC C5 C1 + + 0.1F 2 C1+ 0.1F 4 C15 C2+ 0.1F 6 C211 T1IN 9 R1OUT 5k 1 EN GND 14 *can be returned to either VCC or GND SHDN 16 15 VCC V+ 3 *C3 7 C4 + 0.1F C2 + SP3220 E/EB/EU V- + 0.1F LOGIC INPUTS LOGIC OUTPUTS T1OUT R1IN 13 8 RS-232 OUTPUTS RS-232 INPUTS Figure 11. SP3220E/EB/EU Typical Operating Circuits Date: 8/22/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation 8 Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation 8 DESCRIPTION The SP3220E/EB/EU devices meet the EIA/TIA232 and V.28/V.24 communication protocols and can be implemented in battery-powered, portable, or hand-held applications such as notebook or palmtop computers. The SP3220E/EB/EU devices feature Sipex's proprietary on-board charge pump circuitry that generates 2 x VCC for RS-232 voltage levels from a single +3.0V to +5.5V power supply. This series is ideal for +3.3V-only systems, mixed +3.0V to +5.5V systems, or +5.0V-only systems that require true RS-232 performance. The SP3220EB device has a driver that can operate at a data rate of 250Kbps fully loaded. The SP3220EU can operate at 1000Kbps; the SP3220E operates at a typical data rate of 235Kbps fully loaded. The SP3220E/EB/EU is a 1-driver/1-receiver device ideal for portable or hand-held applications. The SP3220E/EB/EU features a 1A shutdown mode that reduces power consumption and extends battery life in portable systems. Its receivers remains active in shutdown mode, allowing external devices to be monitored using only 1A supply current. THEORY OF OPERATION The SP3220E/EB/EU devices are made up of three basic circuit blocks: 1. Driver, 2. Receiver, and 3. the Sipex proprietary charge pump. Driver The driver is an inverting level transmitter that converts TTL or CMOS logic levels to +5.0V EIA/ TIA-232 levels, inverted relative to the input logic levels. Typically, the RS-232 output voltage swing is +5.5V with no load and at least +5V minimum fully loaded. The driver outputs are protected against infinite short-circuits to ground without degradation in reliability. Driver outputs will meet EIA/TIA562 levels of +3.7V with supply voltages as low as 2.7V. The SP3220EB driver typically can operate at a data rate of 250Kbps fully loaded with 3K in parallel with 1000pF, ensuring compatibility with Date: 8/30/05 PC-to-PC communication software. The SP3220EU driver can guarantee a data rate of 1000Kbps fully loaded with 3 in parallel with 250pF. The slew rate of the SP3220E and SP3220EB outputs are internally limited to a maximum of 30V/ s in order to meet the EIA standards (EIA RS232D 2.1.7, Paragraph 5). The transition of the loaded output from HIGH to LOW also meets the monotonicity requirements of the standard. The slew rate of the SP3220EU is not internally limited. This allows it to transmit at much faster data rates. Figure 12 shows a loopback circuit used to test the RS-232 driver. Figure 13 shows the test results of the loopback circuit with the SP3220EB driver active at 250Kbps with an RS-232 load in parallel with a 1000pF capacitor. Figure 14 shows the test results where the SP3220EU driver was active at 1000Kbps and loaded with an RS-232 receiver in parallel with a 250pF capacitor. A solid RS-232 data transmission rate of 250Kbps provides compatibility with many designs in personal computer peripherals and LAN applications. The SP3220E/EB/EU driver's output stage is turned off (high-Z) when the device is in shutdown mode. When the power is off, the SP3220E/EB/EU device permits the outputs to be driven up to +12V. The driver's input does not have pull-up resistors. Designers should connect an unused input to VCC or GND. In the shutdown mode, the supply current falls to less than 1A, where SHDN = LOW. When the SP3220E/EB/EU device is shut down, the device's driver output is disabled (high-Z) and the charge pump is turned off with V+ pulled down to VCC and V- pulled to GND. The time required to exit shutdown is typically 100ms. Connect SHDN to VCC if the shutdown mode is not used. SHDN has no effect on RxOUT. Note that the driver is enabled only when the magnitude of V- exceeds approximately 3V. (c) Copyright 2005 Sipex Corporation SP3220E/EB/EU High ESD RS-232 Driver/Receiver Date: 8/22/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver 9 (c) Copyright 2005 Sipex Corporation VCC C5 C1 + + 0.1F 0.1F C1+ C1C2 + C2+ 0.1F C2TxIN TxOUT VCC V+ C3 + 0.1F SP3220 E/EB/EU VC4 + 0.1F LOGIC INPUTS LOGIC OUTPUTS RxOUT 5k EN GND RxIN *SHDN VCC (SP3220EU 250pF) (SP3220E/EB 1000pF) Figure 12. SP3220E/EB/EU Driver Loopback Test Circuit Figure 13. SP3220EB Driver Loopback Test Results at 250Kbps Figure 14. SP3220EU Driver Loopback Test Results at 1Mbps Date: 8/22/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation 10 Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation 0 Receivers The receiver converts EIA/TIA-232 levels to TTL or CMOS logic output levels. The receiver has an inverting high-impedance output. This receiver output (RxOUT) is at high-impedance when the enable control EN = HIGH. In the shutdown mode, the receiver can be active or inactive. EN has no effect on TxOUT. The truth table logic of the SP3220E/EB/EU driver and receiver outputs can be found in Table 2. Since receiver input is usually from a transmission line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 300mV. This ensures that the receiver is virtually immune to noisy transmission lines. Should an input be left unconnected, a 5k pulldown resistor to ground will commit the output of the receiver to a HIGH state. CHARGE PUMP The charge pump is a Sipex-patented design (U.S. 5,306,954) and uses a unique approach compared to older less-efficient designs. The charge pump still requires four external capacitors, but uses a four-phase voltage shifting technique to attain symmetrical 5.5V power supplies. The internal power supply consists of a regulated dual charge pump that provides output voltages 5.5V regardless of the input voltage (VCC) over the +3.0V to +5.5V range. In most circumstances, decoupling the power supply can be achieved adequately using a 0.1F bypass capacitor at C5 (refer to Figure 11). In applications that are sensitive to powersupply noise, decouple VCC to ground with a capacitor of the same value as charge-pump capacitor C1. Physically connect bypass capacitors as close to the IC as possible. The charge pumps operate in a discontinuous mode using an internal oscillator. If the output voltages are less than a magnitude of 5.5V, the charge pumps are enabled; if the output voltages exceed a magnitude of 5.5V, the charge pumps are disabled. This oscillator controls the four phases of the voltage shifting. A description of each phase follows. Phase 1 -- VSS charge storage -- During this phase of the clock cycle, the positive side of capacitors C1 and C2 are initially charged to VCC. Cl+ is then switched to GND and the charge in C 1- is transferred to C2-. Since C2+ is connected to VCC, the voltage potential across capacitor C2 is now 2 times VCC. Phase 2 -- VSS transfer -- Phase two of the clock connects the negative terminal of C2 to the VSS storage capacitor and the positive terminal of C2 to GND. This transfers a negative generated voltage to C 3 . This generated voltage is regulated to a minimum voltage of -5.5V. Simultaneous with the transfer of the voltage to C3, the positive side of capacitor C1 is switched to VCC and the negative side is connected to GND. Phase 3 -- VDD charge storage -- The third phase of the clock is identical to the first phase -- the charge transferred in C1 produces -VCC in the negative terminal of C1, which is applied to the negative side of capacitor C2. Since C2+ is at VCC, the voltage potential across C2 is 2 times VCC. SHDN 0 0 1 1 EN 0 1 0 1 TxOUT Tri-state Tri-state Active Active RxOUT Active Tri-state Active Tri-state Table 2. Truth Table Logic for Shutdown and Enable Control Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation Date: 8/22/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation Phase 4 -- VDD transfer -- The fourth phase of the clock connects the negative terminal of C2 to GND, and transfers this positive generated voltage across C2 to C4, the VDD storage capacitor. This voltage is regulated to +5.5V. At this voltage, the internal oscillator is disabled. Simultaneous with the transfer of the voltage to C4, the positive side of capacitor C1 is switched to VCC and the negative side is connected to GND, allowing the charge pump cycle to begin again. The charge pump cycle will continue as long as the operational conditions for the internal oscillator are present. In a no-load condition V+ and V- will be symmetrical, since both V+ and V- are separately generated from VCC. Older charge pump approaches that generate V- from V+ will show a decrease in the magnitude of V- compared to V+ due to the inherent inefficiencies in the design. CHARGE PUMP DESIGN GUIDELINES The charge pump operates with 0.1F capacitors for 3.3V operation. For other supply voltages, see the table for required capacitor values. Do not use values smaller than those listed. Increasing the capacitor values (e.g., by doubling in value) reduces ripple on the transmitter outputs and may slightly reduce power consumption. C2, C3, and C4 may be increased without changing C1's value. The charge pump oscillator typically operates at greater than 250kHz allowing the pump to run efficiently with small 0.1F capacitors. Efficient operation depends on rapidly charging and discharging C1 and C2, therefore capacitors should be mounted close to the IC and have low ESR (equivalent series resistance). Low cost surface mount ceramic capacitors (such as are widely used for power-supply decoupling) are ideal for use on the charge pump. However the charge pumps are designed to be able to function properly with a wide range of capacitor styles and values. If polarized capacitors are used the positive and negative terminals should be connected as shown in the Typical Operating Circuit. Voltage potential across any of the capacitors will never exceed 2 x VCC. Therefore capacitors with working voltages as low as 6.3V rating may be used with a 3.0V VCC supply. The reference terminal of the V+ capacitor may be connected either to VCC or ground, but if connected to ground a minimum 10V working voltage is required. Higher working voltages and/or capacitance values may be advised if operating at higher VCC or to provide greater stability as the capacitors age. Under lightly loaded conditions the intelligent pump oscillator maximizes efficiency by running only as needed to maintain V+ and V-. Since interface transceivers often spend much of their time at idle, this power-efficient innovation can greatly reduce total power consumption. This improvement is made possible by the independent phase sequence of the Sipex charge-pump design. Minimum recommended charge pump capacitor value Input Voltage Vcc 3.0V to 3.6V 3.0V to 5.5V Charge pump Capacitor value for SP3220E/EB/EU C1 - C4 = 0.1uF C1 - C4 = 0.22uF Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation Date: 8/22/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver 2 (c) Copyright 2005 Sipex Corporation VCC = +5V +5V C1 + - C2 + - + C4 - + VDD Storage Capacitor VSS Storage Capacitor - -5V -5V C3 Figure 15. Charge Pump -- Phase 1 VCC = +5V C1 + - C2 + - + C4 - + VDD Storage Capacitor VSS Storage Capacitor - -10V C3 Figure 16. Charge Pump -- Phase 2 [ +6V a) C2+ GND 1 GND 2 b) C2-6V T Ch1 2.00V Ch2 2.00V M 1.00s Ch1 5.48V T T ] Figure 17. Charge Pump Waveforms VCC = +5V +5V C1 + - C2 + - + C4 - + VDD Storage Capacitor VSS Storage Capacitor - -5V -5V C3 Figure 18. Charge Pump -- Phase 3 VCC = +5V +10V C1 + - C2 + - + C4 - + VDD Storage Capacitor VSS Storage Capacitor - C3 Figure 19. Charge Pump -- Phase 4 Date: 8/22/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver 13 (c) Copyright 2005 Sipex Corporation 3 ESD TOLERANCE The SP3220E/EB/EU device incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. The improved ESD tolerance is at least 15kV without damage nor latch-up. There are different methods of ESD testing applied: a) MIL-STD-883, Method 3015.7 b)IEC1000-4-2 Air Discharge c)IEC1000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semiconductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body's potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 20. This method will test the IC's capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently. The IEC-1000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and system manufacturers; they must guarantee a certain amount of ESD protection since the system itself is RC RC SW1 SW1 DC Power Source exposed to the outside environment and human presence. The premise with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC-1000-4-2 is shown in Figure 21. There are two methods within IEC-4-2: the Air Discharge method and the Contact Discharge method. With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge -- such as approach speed of the object carrying the ESD potential to the system and humidity -- will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed. RS RS SW2 SW2 CS CS Device Under Test Figure 20. ESD Test Circuit for Human Body Model Date: 8/22/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation 14 Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transfered without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the equipment from a person in contact with the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC. The circuit models in Figure 20 and 21 represent the typical ESD testing circuits used for all three methods. The CS is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through RS, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test recives a duration of voltage. Contact-Discharge Module RC RC SW1 DC Power Source RS S RV SW2 CS S Device Under Test RS and RV add up to 330 for IEC1000-4-2. Figure 21. ESD Test Circuit for IEC1000-4-2 For the Human Body Model, the current limiting resistor (RS) and the source capacitor (CS) are 1.5k and 100pF, respectively. For IEC-1000-4-2, the current limiting resistor (RS) and the source capacitor (CS) are 330 and 150pF, respectively. The higher CS value and lower RS value in the IEC1000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point. Device Pin Tested Driver Ouputs Receiver Inputs Date: 8/22/05 30A 15A 0A t=0nS t t=30nS Figure 22. ESD Test Waveform for IEC1000-4-2 Human Body Model 15kV 15kV IEC1000-4-2 Air Discharge Direct Contact 15kV 8kV 15kV 8kV 15 Level 4 4 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation 5 PACKAGE: PLASTIC SHRINK SMALL OUTLINE (SSOP) E H D A O e B A1 L DIMENSIONS (Inches) Minimum/Maximum (mm) A A1 B D E e H L O 16-PIN 20-PIN 24-PIN 28-PIN 0.068/0.078 0.068/0.078 (1.73/1.99) (1.73/1.99) 0.002/0.008 0.002/0.008 (0.05/0.21) (0.05/0.21) 0.010/0.015 0.010/0.015 (0.25/0.38) (0.25/0.38) 0.239/0.249 0.278/0.289 (6.07/6.33) (7.07/7.33) 0.205/0.212 0.205/0.212 (5.20/5.38) (5.20/5.38) 0.0256 BSC 0.0256 BSC (0.65 BSC) (0.65 BSC) 0.301/0.311 0.301/0.311 (7.65/7.90) (7.65/7.90) 0.022/0.037 0.022/0.037 (0.55/0.95) (0.55/0.95) 0/8 0/8 (0/8) (0/8) 0.068/0.078 0.068/0.078 (1.73/1.99) (1.73/1.99) 0.002/0.008 0.002/0.008 (0.05/0.21) (0.05/0.21) 0.010/0.015 0.010/0.015 (0.25/0.38) (0.25/0.38) 0.317/0.328 0.397/0.407 (8.07/8.33) (10.07/10.33) 0.205/0.212 0.205/0.212 (5.20/5.38) (5.20/5.38) 0.0256 BSC 0.0256 BSC (0.65 BSC) (0.65 BSC) 0.301/0.311 0.301/0.311 (7.65/7.90) (7.65/7.90) 0.022/0.037 0.022/0.037 (0.55/0.95) (0.55/0.95) 0/8 0/8 (0/8) (0/8) Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation PACKAGE: PLASTIC SMALL OUTLINE (SOIC) E H D A O e B A1 L DIMENSIONS (Inches) Minimum/Maximum 16-PIN (mm) A 0.090/0.104 (2.29/2.649) A1 0.004/0.012 (0.102/0.300) B 0.013/0.020 (0.330/0.508) D 0.398/0.413 (10.10/10.49) E 0.291/0.299 (7.402/7.600) e 0.050 BSC (1.270 BSC) H 0.394/0.419 (10.00/10.64) L 0.016/0.050 (0.406/1.270) O 0/8 (0/8) 18-PIN 0.090/0.104 (2.29/2.649)) 0.004/0.012 (0.102/0.300) 0.013/0.020 (0.330/0.508) 0.447/0.463 (11.35/11.74) 0.291/0.299 (7.402/7.600) 0.050 BSC (1.270 BSC) 0.394/0.419 (10.00/10.64) 0.016/0.050 (0.406/1.270) 0/8 (0/8) Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation PACKAGE: PLASTIC THIN SMALL OUTLINE (TSSOP) E2 E D A O e B A1 L DIMENSIONS in inches (mm) Minimum/Maximum A A1 B D E e E2 L O 16-PIN - /0.043 (- /1.10) 0.002/0.006 (0.05/0.15) 0.007/0.012 (0.19/0.30) 0.193/0.201 (4.90/5.10) 0.169/0.177 (4.30/4.50) 0.026 BSC (0.65 BSC) 0.126 BSC (3.20 BSC) 0.020/0.030 (0.50/0.75) 0/8 20-PIN - /0.043 (- /1.10) 0.002/0.006 (0.05/0.15) 0.007/0.012 (0.19/0.30) 0.252/0.260 (6.40/6.60) 0.169/0.177 (4.30/4.50) 0.026 BSC (0.65 BSC) 0.126 BSC (3.20 BSC) 0.020/0.030 (0.50/0.75) 0/8 Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation 8 Contact factory for availability of the following legacy part numbers. For long term availability Sipex recommends upgrades as listed below. All upgrade part numbers shown are fully pinout and function compatible with legacy part numbers. Upgrade part numbers may contain feature and/or performance enhancements or other changes to datasheet parameters. RECOMMENDED UPGRADES Legacy Part Number Recommended Upgrade SP3220CA .................. SP3220ECA SP3220CA-L ............... SP3220ECA-L SP3220CT .................. SP3220ECT SP3220CY .................. SP3220ECY SP3220EA .................. SP3220EEA SP3220ET ................... SP3220EET SP3220EY .................. SP3220EEY SP3220BCA ................ SP3220EBCA SP3220BCT ................ SP3220EBCT SP3220BCY ................ SP3220EBCY SP3220BEA ................ SP3220EBEA SP3220BET ................ SP3220EBET SP3220BEY ................ SP3220EBEY SP3220UCA ................ SP3220EUCA SP3220UCT ................ SP3220EUCT SP3220UCY ................ SP3220EUCY SP3220UEA ................ SP3220EUEA SP3220UET ................ SP3220EUET SP3220UEY ................ SP3220EUEY Date: 8/22/05 Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation (c) Copyright 2005 Sipex Corporation 19 ORDERING INFORMATION Model Temperature Range Package Type SP3220EBCA .......................................... 0C to +70C .......................................... 16-Pin SSOP SP3220EBCA/TR ..................................... 0C to +70C .......................................... 16-Pin SSOP SP3220EBCT ........................................... 0C to +70C .................................. 16-Pin Wide SOIC SP3220EBCT/TR ..................................... 0C to +70C .................................. 16-Pin Wide SOIC SP3220EBCY .......................................... 0C to +70C ........................................ 16-Pin TSSOP SP3220EBCY/TR ..................................... 0C to +70C ........................................ 16-Pin TSSOP SP3220EBEA .......................................... -40C to +85C SP3220EBEA/TR .................................... -40C to +85C SP3220EBET .......................................... -40C to +85C SP3220EBET/TR .................................... -40C to +85C SP3220EBEY .......................................... -40C to +85C SP3220EBEY/TR .................................... -40C to +85C SP3220ECA ............................................. SP3220ECA/TR ....................................... SP3220ECT ............................................. SP3220ECT/TR ....................................... SP3220ECY ............................................. SP3220ECY/TR ....................................... ........................................ 16-Pin SSOP ........................................ 16-Pin SSOP ................................ 16-Pin Wide SOIC ................................ 16-Pin Wide SOIC ...................................... 16-Pin TSSOP ...................................... 16-Pin TSSOP 0C to +70C .......................................... 16-Pin SSOP 0C to +70C .......................................... 16-Pin SSOP 0C to +70C ........................................ 16-Pin WSOIC 0C to +70C ........................................ 16-Pin WSOIC 0C to +70C ........................................ 16-Pin TSSOP 0C to +70C ........................................ 16-Pin TSSOP Available in lead free packaging. To order add "-L" suffix to part number. Example: SP3220ECA/TR = standard; SP3220ECA-L/TR = Lead Free /TR = Tape and Reel Pack quantity is 1,500 for WSOIC, or SSOP; pack quantity is 2,500 for 16-pin TSSOP. Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others. Corporation ANALOG EXCELLENCE Sipex Corporation Headquarters and Sales Office 233 South Hillview Drive Milpitas, CA 95035 TEL: (408) 934-7500 FAX: (408) 935-7600 Sales Office 22 Linnell Circle Billerica, MA 01821 TEL: (978) 667-8700 FAX: (978) 670-9001 e-mail: sales@sipex.com Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver (c) Copyright 2005 Sipex Corporation Date: 8/22/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver 20 (c) Copyright 2005 Sipex Corporation ORDERING INFORMATION Model Temperature Range Package Type SP3220EEA ............................................ -40C to +85C ........................................ 16-Pin SSOP SP3220EEA/TR ...................................... -40C to +85C ........................................ 16-Pin SSOP SP3220EET ............................................ -40C to +85C ...................................... 16-Pin WSOIC SP3220EET/TR ...................................... -40C to +85C ...................................... 16-Pin WSOIC SP3220EEY ............................................ -40C to +85C ...................................... 16-Pin TSSOP SP3220EEY/TR ...................................... -40C to +85C ...................................... 16-Pin TSSOP SP3220EUCA .......................................... SP3220EUCA/TR .................................... SP3220EUCT .......................................... SP3220EUCT/TR ..................................... SP3220EUCY/TR .................................... SP3220EUCY .......................................... 0C to +70C .......................................... 16-Pin SSOP 0C to +70C .......................................... 16-Pin SSOP 0C to +70C .................................. 16-Pin Wide SOIC 0C to +70C .................................. 16-Pin Wide SOIC 0C to +70C ........................................ 16-Pin TSSOP 0C to +70C ........................................ 16-Pin TSSOP ........................................ 16-Pin SSOP ........................................ 16-Pin SSOP ................................ 16-Pin Wide SOIC ................................ 16-Pin Wide SOIC ...................................... 16-Pin TSSOP ...................................... 16-Pin TSSOP SP3220EUEA ......................................... -40C to +85C SP3220EUEA/TR .................................... -40C to +85C SP3220EUET .......................................... -40C to +85C SP3220EUET/TR .................................... -40C to +85C SP3220EUEY ......................................... -40C to +85C SP3220EUEY/TR .................................... -40C to +85C Available in lead free packaging. To order add "-L" suffix to part number. Example: SP3220ECA/TR = standard; SP3220ECA-L/TR = Lead Free /TR = Tape and Reel Pack quantity is 1,500 for WSOIC, or SSOP; pack quantity is 2,500 for 16-pin TSSOP. Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others. Corporation ANALOG EXCELLENCE Sipex Corporation Headquarters and Sales Office 233 South Hillview Drive Milpitas, CA 95035 TEL: (408) 934-7500 FAX: (408) 935-7600 Sales Office 22 Linnell Circle Billerica, MA 01821 TEL: (978) 667-8700 FAX: (978) 670-9001 e-mail: sales@sipex.com Date: 8/22/05 Date: 8/30/05 SP3220E/EB/EU High ESD RS-232 Driver/Receiver SP3220E/EB/EU High ESD RS-232 Driver/Receiver 21 2 (c) Copyright 2005 Sipex Corporation (c) Copyright 2005 Sipex Corporation |
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